Overview of customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s
Silicon Carbide (SiC), also known as carborundum, is a synthetic ceramic compound made up of silicon and carbon atoms. Known for its exceptional hardness, thermal conductivity, and resistance to chemical reactions and wear, SiC is a versatile material widely used in high-performance applications that demand superior physical and electronic properties. Its unique crystal structure, which can exist in several polytypes, contributes to its multifaceted utility across various industries.
Features of customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s
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Exceptional Hardness: Silicon carbide ranks just below diamond and boron carbide in hardness, making it an ideal abrasive material.
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High Thermal Conductivity: It is an excellent heat conductor, capable of dissipating heat rapidly, which is crucial for high-power electronic and semiconductor devices.
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Chemical Stability: Resistant to most acids, alkalis, and salt solutions, SiC maintains its properties even under harsh chemical environments.
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Wide Bandgap Semiconducting Material: As a wide bandgap semiconductor, it operates at higher temperatures and frequencies than conventional semiconductors like silicon.
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Mechanical Strength and Wear Resistance: Offers high mechanical strength and excellent wear resistance, suitable for mechanical seals, bearings, and pump components.
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Thermal Shock Resistance: Can withstand rapid temperature changes without cracking or degrading, important for applications involving cyclic heating and cooling.
(customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s)
Parameters of customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s
The customized Mingsha abrasive green silicon carbideGC T1A vitrified bond grinding wheel for metal buffing polishing wheel is a specialized tool designed to grind and polish metals efficiently. Here are the key parameters of this grinding wheel:
1. Material: Green silicon carbide (SiC) is used as the abrasive material due to its excellent wear resistance, high cutting speed, and chemical stability.
2. Abrasive: The green SiC particle size is typically between 35-80 microns, ensuring an even distribution of grain sizes on the grinding surface.
3. Bonding mechanism: The green SiC GC/T1A grits are specifically formulated to form a bond with the metal surface, preventing damage during polishing and maintaining a consistent finish.
4. Vitrification process: The green SiC GC/T1A grits undergo a vitrification process, which involves melting and solidifying them at a high temperature in a vacuum environment. This process improves the grinding performance by creating a strong, durable bond between the grinding wheel and the metal surface.
5. Wheel size: The 40mm diameter wheel allows for good grip on the metal surface and adequate surface coverage for efficient grinding and polishing.
6. Cutting speed: The maximum operating speed for this grinding wheel is generally limited to 40 m/s, but it can be increased depending on specific applications.
To summarize, this customized Mingsha abrasive green silicon carbideGC T1A vitrified bond grinding wheel is designed for metal buffs and polishing tools. It features exceptional Abrasive and Bonding properties, combined with a suitable wheel size and cutting speed to provide consistent, efficient results. Please refer to the product specifications for more detailed information.
(customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s)
Applications of customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s
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Semiconductor Devices: Used in high-voltage, high-frequency, and high-temperature power electronics, such as MOSFETs, Schottky diodes, and power modules.
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Abrasive Materials: As an abrasive grain in grinding wheels, sandpapers, and cutting tools due to its hardness and wear resistance.
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Refractories and Furnace Linings: In high-temperature furnaces and kilns because of its outstanding thermal stability and resistance to corrosion.
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Ceramic Armor: In lightweight armor systems due to its combination of hardness, toughness, and low density.
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Chemical Process Equipment: For pumps, valves, and seals in corrosive chemical environments where metals would corrode.
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Wire Sawing: As the abrasive medium in wire saws for slicing silicon wafers in the semiconductor industry and gemstones.
Company Profile
MyCarbides is a trusted global chemical material supplier & manufacturer with over 12-year-experience in providing super high-quality carbides and relative products.
The company has a professional technical department and Quality Supervision Department, a well-equipped laboratory, and equipped with advanced testing equipment and after-sales customer service center.
If you are looking for high-quality carbide materials and relative products, please feel free to contact us or click on the needed products to send an inquiry.
Payment Methods
L/C, T/T, Western Union, Paypal, Credit Card etc.
Shipment
It could be shipped by sea, by air, or by reveal ASAP as soon as repayment receipt.
FAQs of customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s
Q: How is customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s produced?
A: customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s is primarily synthesized through the Acheson process, which involves heating a mixture of silica sand and carbon (usually in the form of coke) in an electric furnace at high temperatures.
Q: Is customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s conductive?
A: Yes, customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s is a semiconductor material with unique electronic properties, including high breakdown voltage and thermal conductivity, making it suitable for power electronics.
Q: Can customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s be used in extreme environments?
A: Absolutely, SiC’s high temperature stability, resistance to radiation damage, and ability to withstand thermal shocks make it ideal for applications in space, nuclear reactors, and deep-well drilling.
Q: What gives customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s its unique properties?
A: The covalent bond structure of customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s, along with its tight crystal lattice, contributes to its hardness, high melting point, and resistance to wear and corrosion.
Q: Is customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s biocompatible?
A: Scustomized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s has been investigated for biomedical applications due to its biocompatibility, inertness, and durability, with potential uses in orthopedic implants and surgical instruments.
(customized Mingsha abrasive green silicon carbide GC T1A vitrified bond grinding wheel for metal buffing polishing wheel 40m/s)
